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  • 中国标准连:ISSN1005-2895
  • 续出版物号: CN 33-1180/TH
  • 主管单位:轻工业杭州机电设计研究院有限公司
  • 主办单位:轻工业杭州机电设计研究院有限公司、中国轻工机械协会、中国轻工业机械总公司
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纪东升, 罗一平, 任洪娟, 魏丹, 刘文涛.磁流变液屈服应力测试装置温度场优化[J].轻工机械,2020,38(2):38-44
磁流变液屈服应力测试装置温度场优化
Temperature Field Optimization of Magnetorheological Fluid Yield Stress Testing Device
  
DOI:10.3969/j.issn.1005 2895.2020.02.007
中文关键词:  磁流变液  漆包线  装配间隙  热导率  FLUENT
英文关键词:MRF(magnetorheological fluid)  enameled wire  assembly gap  thermal conductivity  FLUENT
基金项目:上海市地方能力建设基金资助(19030501100)。
作者单位
纪东升, 罗一平, 任洪娟, 魏丹, 刘文涛 上海工程技术大学 机械与汽车工程学院 上海201620 
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中文摘要:
      磁流变液(magnetorheological fluid,MRF)屈服应力测试装置在工作运行过程中产生了大量的热,导致测试装置温度升高,屈服应力测试精度下降的结果;同时对磁流变液特性也造成了很大的影响。课题组基于FLUENT软件对测试装置进行仿真分析,以提高测试精度。首先,设计屈服应力测试装置,建立包含漆包线、装配间隙等特征的测试装置温度场模型;其次,对测试装置进行网格划分并运用仿真软件对温度场变化进行模拟研究;最后,在仿真模型的基础上,对漆包线绕组综合热导率和测试装置装配间隙进行分析。研究得到了温度对装置的影响规律,确定了最佳综合热导率及装配间隙;并确定该装置测试屈服应力时的最佳温度场。温度场研究提高了该装置对屈服应力测试的精度。
英文摘要:
      In view of the fact that the yield stress testing device of magnetorheological fluid (MRF) generates a lot of heat during its operation, resulting in the rise of the temperature of the testing device and the decrease of the accuracy of the yield stress testing, which also has a great influence on the characteristics of MRF. The simulation analysis of the test device was carried out based on FLUENT software to improve the test accuracy. Firstly, the yield stress testing device was designed and the temperature field model of the testing device including the characteristics of enameled wire and assembly gap was established. Secondly, the testing device was meshed and the temperature field changes were simulated by simulation software. Finally, the comprehensive thermal conductivity of enameled wire windings and the assembly gap of the device were analyzed based on the simulation model. The results show that the influence of temperature on the yield stress testing device is obtained , and the optimum comprehensive thermal conductivity and assembly gap are determined. The optimum temperature field of the device for testing yield stress is determined. The temperature field study improves the accuracy of the device for testing yield stress.
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