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  • 中国标准连:ISSN1005-2895
  • 续出版物号: CN 33-1180/TH
  • 主管单位:轻工业杭州机电设计研究院有限公司
  • 主办单位:轻工业杭州机电设计研究院有限公司、中国轻工机械协会、中国轻工业机械总公司
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李莹, 张敏良, 董慧婷, 陈佳鑫, 刘晓峰.椭圆振动车削TC4的切屑形态和切削力研究[J].轻工机械,2020,38(5):24-31
椭圆振动车削TC4的切屑形态和切削力研究
Study on Chip Morphology and Cutting Force in Elliptical Vibration Turning TC4
  
DOI:10.3969/j.issn.1005 2895.2020.05.005
中文关键词:  椭圆振动车削  切削力模型  振动参数  切屑形态  切削力
英文关键词:EVC(elliptic vibration cutting)  cutting force model  vibration parameters  chip morphology  cutting force
基金项目:
作者单位
李莹, 张敏良, 董慧婷, 陈佳鑫, 刘晓峰 上海工程技术大学 机械与汽车工程学院 上海201620 
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中文摘要:
      为探究超声椭圆振动车削钛合金TC4过程中振幅、频率和刀尖圆角半径对切屑和切削力的影响,课题组通过建立有限元模型,将常规切削(CC)和椭圆振动切削(EVC)钛合金TC4过程进行对比研究。首先对所用超声椭圆振动的运动特性进行推导,确定刀屑接触率;其次通过理论分析,将切屑和切削力相结合,建立切削力模型;最后分别研究不同频率、振幅对超声椭圆振动切削稳定过程时的切屑形态、切削力和切削温度的影响。研究结果表明:椭圆振动切削过程刀具和切屑间存在周期性地分离,可以用刀屑接触率ts表示;在一定的范围内,增加振动幅值、振动频率以及刀尖圆角半径可以减小切屑厚度,降低切削力;EVC方式下可以选择合理的参数来降低切削力,并可以通过测量宏观切屑厚度来预测切削力,更好地指导生产加工。
英文摘要:
      In order to explore the influence of amplitude, frequency and fillet radius on chip and cutting force during ultrasonic elliptical vibration cutting (EVC) of titanium alloy TC4, a finite element model was established to compare the conventional cutting (CC) and elliptical vibration cutting (EVC) of titanium alloy TC4. Firstly, the motion characteristics of ultrasonic elliptical vibration in this study were deduced to determine the chip contact rate. Secondly, the cutting force model was established by combining chip and cutting force through theoretical analysis. Finally, the effects of different frequencies, amplitudes and fillet radius on chip morphology, cutting force and cutting temperature during cutting stability were studied respectively. The research shows that there is periodic chip separation in elliptical vibration cutting process, which can be expressed by chip contact ratio ts; In a certain range, the chip thickness and cutting force can be reduced by increasing vibration amplitude, vibration frequency and fillet radius. Under EVC mode, reasonable parameters can be selected to reduce cutting force, and cutting force can be predicted by measuring macroscopic chip thickness to guide the production and processing better.
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